Features:

• Includes chapters contributed by IEEE members and industry experts on the latest technologies in electronic devices and systems packaging
• Covers a range of applied technologies and concepts that are necessary to allow the user to follow reasonable steps to reach a defined goal
• Focuses on key issues facing the packaging industry, including efficiency vs. cost considerations, EMI/RFI issues, electronic design automation, thermal management, and connector technologies
• Provides a "Where Else?" section in each chapter which guides the reader to other sections of the handbook where similar issues are discussed

The Electronic Packaging Handbook provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.

Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature.

Topics addressed include:

• Design automation
• New IC packaging technologies
• Materials
• Testing and safety

The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

Contents

1. Fundamentals of the Design Process
2. Surface Mount Technology
3. Integrated Circuit Packages
4. Direct Chip Attach
5. Circuit Boards
6. EMC and PCB Design
7. Hybrid Assemblies
8. Interconnects
9. Design for Test
10. Adhesive and Its Application
11. Thermal Management
12. Testing
13. Inspection
14. Package/Enclosure
15. Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach
16. Product Safety and Third-Party Certification

Appendix: Definitions
Index

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