Handbook of Thin Film Deposition traces the technology behind the spectacular growth in the silicon semiconductor industry and the continuized trend in miniaturization over the last 20 years.
Contents
Recent Changes in the Semiconductor Industry
- Cost of Device Fabrication
- Technology Trends, Chip Size, Performance, and Moore's Law
Deposition Technologies and Applications: Introduction and Overview
- Objective and Scope of This Book
- Importance of Deposition Technology in Modern Fabrication Processes
- Classification of Deposition Technologies
- Overview of Various Thin-Film Deposition Technologies
- Criteria for the Selection of a Deposition Technology for Specific Applications
- Summary and Perspective for the Future
Silicon Epitaxy by Chemical Vapor Deposition
- Introduction
- Theory of Silicon Epitaxy by CVD
- Silicon Epitaxy Process Chemistry
- Commercial Reactor Geometries
- Theory of Chemical Vapor Deposition
- Process Adjustments
- Equipment Considerations for Silicon Epitaxy
- Other Equipment Considerations
- Defects in Epitaxy Layers
- Safety
- Key Technical Issues
- New Materials Technology for Silicon Epitaxy
- Low Temperature Epitaxy
Chemical Vapor Deposition of Silicon Dioxide Films
- Introduction
- Overview of Atmospheric Pressure CVD
- Plasma Enhanced Chemical Vapor Deposition
- Properties of Dielectric Films
- New Deposition Technologies
- Future Directions for CVD of Dielectric Films
- Summary
Metal Organic Chemical Vapor Deposition: Technology and Equipment
- Introduction
- Applications of MOCVD
- Physical and Chemical Properties of Sources used in MOCVD
- Growth Mechanisms, Conditions, and Chemistry
- System Design and Construction
- Future Developments
Feature Scale Modeling
- Introduction
- Components of Etch and Deposition Modeling
- Etch Modeling
- Etch Examples
- Deposition Modeling
- Deposition Examples
- Real Life
The Role of Metrology and Inspection in Semiconductor Processing
- Overview
- Introduction to Metrology and Inspection
- Metrology and Inspection Trends: Past, Present, and Future
- Theory of Operation, Equipment Design Principles, Main Applications, and Strengths and Limitations of Metrology and Inspection Systems
Contamination Control, Defect Detection, and Yield Enhancement in Gigabit Manufacturing
- Introduction
- Contamination and Defect Goals for ULSI Devices
- Sources of Particles
- Contamination and Defect Detection: Tools of the Trade
- Advanced Techniques for Trace Contamination Monitoring
- Substrate Surface Preparation Techniques
- Challenges to ULSI (Gigabit) Contamination Control
- Process Evolution
- Evolution of Circuit Based Electrical Defect Detection
- Conclusion
Sputtering and Sputter Deposition
- Introduction
- Physical Sputtering Theory
- Plasmas and Sputtering Systems
- Deposition Rates and Efficiencies
- Reactive Sputter Deposition
- Sputtering Systems
- Conclusions and Future Directions
Laser and Electron Beam Assisted Processing
- Introduction
- Beam Assissted CVD of Thin Films
- Submicron Pattern Delineation With Large Area Glow Discharge Pulsed Electron-Beams
- Beam Induced Thermal Processes
- Summary and Conclusions
Molecular Beam Epitaxy: Equipment and Practice
- The Basic MBE Process
- Competing Deposition Technologies
- MBE-Grown Devices
- MBE Deposition Equipment
- Principles of Operation
- Recent Advances
- Future Developments
Ion Beam Deposition
- Introduction
- Overview of Ion Beam Applications
- Ion Beam Probing
- Substrate Cleaning With Ion Beams
- Applications
- Concluding Comments
Chemical Mechanical Polishing
- Introduction
- Processing
- Polish Equipment
- History
- Innovations
- Automation
- Wafer/Pad Relative Motion
- Future Challenges
Organic Dielectrics in Multilevel Metallization of Integrated Circuits
- General Introduction
- Historical Perspective
- Fundamental Chemistry of Organic Dielectrics
- Processing of Polymer Films
- Process Integration With Organic Dielectrics
- Reliability
- Performance Advantages of Organic Dielectrics
- Future Trends
Performance, Processing, and Lithography Trends
- Introduction
- Scaling the Transistor
- Low Resistance: Change to Copper-Based Metallurgy
- Trend to Low K Materials
- Lithography and Planarization
- Challenges to Contamination/Cleaning
- Summary
Index
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