The second edition of the Handbook of Silicon Wafer Cleaning Technology covers wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits.

The integration of the clean processes into the device manufacturing flow is presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes.

The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered.

Features:

• Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits
• As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone who manufactures integrated circuits, or supplies the semiconductor and microelectronics industries
• Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
• Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol

Contents

Part 1: Introduction and Overview

1. Overview and Evolution of Silicon Wafer Cleaning Technology
2. Overview of Wafer Contamination and Defectivity

Part 2: Wet Chemical Processes

3. Particle Deposition and Adhesion
4. Aqueous Cleaning and Surface Conditioning Processes

Part 3: Dry Cleaning Processes

5. Gas-phase Wafer Cleaning Technology
6. Plasma Stripping, Cleaning, and Surface Conditioning
7. Cryogenic Aerosols and Supercritical Fluid Cleaning

Part 4: Analytical and Control Aspects

8. Detection and Measurement of Particulate Contaminants
9. Surface Chemical Composition and Morphology
10. Ultratrace Impurity Analysis of Water Surfaces

Part 5: Directions for the Near Future

11. New Cleaning and Surface Conditioning Techniques and Technologies

Index

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