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Silicon Hetrostructure Handbook
Materials, Fabrication, Devices, Circuits, and Applications edited by John D. Cressler
Silicon Hetrostructure Handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications.
Features:
- Provides broad, comprehensive, in-depth, and authoritative coverage of the current state of the field
- Features a global "who's who" of expert contributors, each from a leading industrial or research organization from around the world
- Presents up-to-date research results, a comprehensive list of seminal references, and state-of-the-art devices and circuits
- Includes a foreword by Dr. Bernard S. Meyerson, nearly 1000 figures, and indispensable appendices
Contents
SiGe and Si Strained-Layer Epitaxy
- Overview: SiGe and Si Strained-Layer Epitaxy
- Strained SiGe and Si Epitaxy
- Si/SiGe(C) Eptiaxy by RTCVD
- MBE Growth Techniques
- UHV/CVD Growth Techniques; T.N. Adam
- Defects and Diffusion in SiGe and Strained Si
- Stability Constraints in SiGe Epitaxy
- Electronic Properties of Strained Si/SiGe and Si1-yCy Alloys
- Carbon Doping of SiGe
- Contact Metallization on Silicon-Germanium
- Selective Etching Techniques for SiGe/Si
Fabrication of SiGe HBT Bicmos Technology
- Overview: Fabrication of SiGe HBT BiCMOS Technology
- Device Structures and BiCMOS Integration
- SiGe HBTs on CMOS-Compatible SOI
- Passive Components
- Industry Examples at State-of-the-Art: IBM
- Industry Examples at State-of-the-Art: Jazz
- Industry Examples at State-of-the-Art: Hitachi
- Industry Examples at State-of-the-Art: Infineon
- Industry Examples at State-of-the-Art: IHP
- Industry Examples at State-of-the-Art: ST
- Industry Examples at State-of-the-Art: Texas Instruments
- Industry Examples at State-of-the-Art: Philips
SiGe Hbts
- Overview: SiGe HBTs
- Device Physics
- Second-Order Effects
- Low-Frequency Noise
- Broadband Noise
- Microscopic Noise Simulation
- Linearity
- pnp SiGe HBTs
- Temperature Effects
- Radiation Effects
- Reliability Issues
- Self-Heating and Thermal Effects
- Device-Level Simulation
- SiGe HBT Performance Limits
Heterostructure Fets
- Overview: Heterostructure FETs
- Biaxial Strained Si CMOS
- Uniaxial Stressed Si MOSFET
- SiGe-Channel HFETs
- Industry Examples at State-of-the-Art: Intel's 90 nm Logic Technologies
Other Heterostructure Devices
- Overview: Other Heterostructure Devices
- Resonant Tunneling Devices
- IMPATT Diodes
- Engineered Substrates for Electronic and Optoelectronic Systems
- Self-Assembling Nanostructures in Ge(Si)-Si Heteroepitaxy
Optoelectronic Compnents
- Overview: Optoelectronic Components
- Si-SiGe LEDs
- Near-Infrared Detectors
- Si-Based Photonic Transistors for Integrated Optoelectronics
- Si-SiGe Quantum Cascade Emitters
Measurement and Modeling
- Overview: Measurement and Modeling
- Best-Practice AC Measurement Techniques
- Industrial Application of TCAD for SiGe Development
- Compact Modeling of SiGe HBTs: HICUM
- Compact Modeling of SiGe HBTs: MEXTRAM
- CAD Tools and Design Kits
- Parasitic Modeling and Noise Mitigation Approaches in Silicon Germanium RF Designs
- Transmission Lines on Si
- Improved De-Embedding Techniques
Circuits and Applications
- Overview: Circuits and Applications
- SiGe as an Enabler for Wireless Communications Systems
- LNA Optimization Strategies
- Linearization Techniques
- SiGe MMICs
- SiGe Millimeter-Wave ICs
- Wireless Building Blocks Using SiGe HBTs
- Direct Conversion Architectures for SiGe Radios
- RF MEMS Techniques in Si/SiGe
- Wideband Antennas on Silicon
- Packaging Issues for SiGe Circuits
- Industry Examples at State-of-the-Art: IBM
- Industry Examples at State-of-the-Art: Hitachi
- Industry Examples at State-of-the-Art: ST
Index
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Silicon Hetrostructure Handbook
Materials, Fabrication, Devices, Circuits, and Applications edited by John D. Cressler
2005 • 1248 pages • $168.95 + shipping
Texas residents please add 6.75 % sales tax
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