Features:
- Detailed coverage of tribology principles in grinding, the most commonly used abrasive process, demonstrates potential process improvements and solutions to common manufacturing problems including workpiece burn and rapid wheel wear.
- Kinematics discussion focuses on variable grain distributions.
- Applies heat transfer principles to explore process effects on surface quality.
- Provides new information on effective fluid delivery.
- Explores deformation processes through molecular dynamics simulation.
- Covers a wide variety of abrasive materials from sol gel grain abrasives to ceramics and diamonds to superabrasives such as vitrified cubic born nitride.
Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality.
Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.
Contents
- Introduction to Abrasive Processes
- Tribosystems of Abrasive Machining Processes
- Kinematic Models of Abrasive Contacts
- Contact Mechanics
- Forces, Friction, and Energy
- Thermal Design of Processes
- Molecular Dynamics for Abrasive Process Simulation
- Fluid Delivery
- Electrolytic In-Process Dressing (ELID) Grinding and Polishing
- Grinding Wheel and Abrasive Topography
- Abrasives and Abrasive Tools
- Conditioning of Abrasive Wheels
- Loose Abrasive Processes
- Process Fluids for Abrasive Machining
- Tribology of Abrasive Machining
- Processed Materials
Glossary
Appendix
Index
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