MEMS/MOEMS Packaging rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability.

With this as a starting point, MEMS/MOEMS Packaging moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.

Contents:

1. Engineering Fundamentals of Packaging for MEMS and MOEM Devices
2. Principles, Materials and Fabrication of MEMS and MOEM Devices
3. Evaluation Methods for MEMS and MOEM Packaging Challenges
4. MEMS Packaging Processes
5. From MEMS and MOEMS to Nano Technology

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ORDER NOW MEMS/MOEMS Packaging Concepts, Designs, Materials, and Processes by Ken Gilleo 2005 • 220 pages • $164.00 + shipping Texas residents please add 7 % sales tax